Protect components and improve stability - In order to extend the life of your power electronics, you need to maintain low thermal resistance and protect components from shock, moisture and debris. LORD CoolTherm® low viscosity, highly thermally conductive pottants provide a robust thermal interface, as well as protect delicate electrical components. Additionally, we offer a variety of other thermal interface materials — available in gels, greases, adhesives and gap fillers — that will not only improve heat flow but also provide excellent isolation and vibration dampening.
Our dedicated technical service staff will work with you on a customized solution and can help select the correct material for your application that aligns with your cost targets and process for improving performance.
Our thermally conductive encapsulants provide electrical isolation and protection, and their low viscosity enables better impregnation and displacement of air.
Two-Component Room Temperature Curing Electrically Isolative 1:1 Mix Ratio
|Product||Chemistry||Thermal Conductivity (W/m·K)||Viscosity (cps @ 25°C)||Density (g/cm3)|
Formulated for standard MMD equipment, our adhesives provide your application with structural integrity. Our thermally conductive adhesives not only provide mechanical rigidity but also a thermal connection where heat is a problem.
One- and Two-Component Bond a Wide Variety of Substrates Room Temperature Curing Varialbe Cure Speeds
|Product||Chemistry||Thermal Conductivity (W/m·K)||Lap Shear Strength (MPa)|
|CoolTherm MT-220||Epoxy - Silicone Hybrid||4.2||6.2|
|CoolTherm MD-140 SP||Epoxy||12.0||48.3|
Our experts understand that different applications require different solutions. We offer a broad portfolio of gels and greases to meet your unique specifications.
One-Component Low Thermal Resistance Properties Reworkable
|Product||Chemistry||Thermal Conductivity (W/m·K)||Viscosity (cPs @ 25°C)|
|CoolTherm SG-21||Silicone (grease)||0.8||1,800,000|
|CoolTherm MG-121||Silicone (gel)||2.3||75,000|
|CoolTherm MG-133||Silicone (gel)||3.6||105,900|
Get the best performance out of your components by filling in surface imperfections with a thermally conductive gap filler. They are a stay-in-place solution and cure as a gel, easing the stresses caused by thermal differences and flex.
Two-Component Low Outgas Options Room Temperature Curing Electrically Isolative 1:1 Mix Ratio
|Product||Chemistry||Thermal Conductivity (W/m·K)||Shore Hardness (OO)||Density (g/cm3)|